HomeMy WebLinkAboutT7-00-TECHNOLOGY-RISER-DIAGRAMS-Rev.0�
d
FOURTH
FLOOR
HOSPITAL
THIRD
FLOOR
HOSPITAL
SECOND
FLOOR
HOSPITAL
FIRST
FLOOR
HOSPITAL
FOURTH
FLOOR
PARKING
GARAGE
THIRD
FLOOR
PARKING
GARAGE
I ��
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PROVIDED I
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IDISTRIBUTION I
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MAIN TELECOMMUNICATIONS ROOM - MC4
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NO SCALE
NOTES:
1. THIS RISER IS DIAGRAMMATIC AND MAV NOT SHOW ACTUAL ROUTING OR QUANTITIES OF
MATERIALS SHOWN. THIS RISER IS SHOWN FOR CLARIFICATION OF CONNECTION(S),
LOCATIONS AND CABLE TYPE ALL WFORMATION OUTLETS ARE TYPICAL OF THE OUTLETS
IN THE AREA SHOWN. REFER TO FLOOR PLANS FOR MORE SPEQFlC ROUTING
INFORMATION. REFER TO SPECIFICATIONS FOR AD�ITIONAL REpUIREMENTS.
2. REFER TO ROOR PLANS FOR QUANTITV OF CABLES AND JACKS TO BE INSTALLED AT
EACH MFORMATION OUTLET.
KEVNOTES�. Q
1. REFERTOCOVERPAGEANDFLOORPLANSFORTELECOMMUNICATIONSROOM
LOCATIONS.
2 EXISTINGFRANCISCANRACKORCABMETINSTALLEDASPARTOFTHEHOSPITAL
PROJECT. REFER TO 1/T6-O IN BPN5 FOR MORE WFORMATION.
3. REFER TO COVER PAGE AND FLOOR PLANS IN BPk5 oRAW ING SET FOR
TELECOMMUNICATION ROOM LOCATIONS.
4. 12 MM112 SM STRAND RBER OPTIC CABLE.
5. FIBER BACKBONE CABLE CONTINUES FROM MC-1 IN THE HOSPITAL THROUGH THE
HOPITALSECOND FLOOR CEILING, THROUGH UN�ERSIDE OF THE PEDESTRIAN BRIDGE IN
ROUTETOTHE FIRST FLOOR PARKING GARAGE TELECOMMUNICATION ROOM TR-iG.
6. RACKORCABWETAS�ERNE�ONTHETELECOMROOMLAVOUT. REFERTOTHE
TELECOM ROOM REFERENCE MATRIXON THE COVER PAGE FOR LOCATION.
ELECTRICAL
FOURTH
FLOOR
THIRD
FLOOR
SECOND
FLOOR
FIRST E�E�rR��A�ENrRAN�E
INTERSVSTEM BONDING
TERMINATION
FLOOR ,�
GROUNDING ELECTRODE
CON�UCTOR BY OTHERS
ELECTRICAL GROUNDING
ELECTROOESVSTEM
��X�:I�I
�Y BONDIN(
� ��TR-iG
SC-GND-1
� J
iER DIAGRAM
NOTES
1. THIS RISER IS �IAGRAMMATIC AND MAY NOT SHOW ACTUAL ROUTING OR �UANTITIES OF
MATERIALS. THIS RISER IS SHOWN FOR CLARIRCATION OF CONNECTION LOCATIONSAND
CONDUCTOR TVPE. ALL CONNECTIONS AND SVSTEM DEVICES SHOW N ARE TVPICAL AND NOT
REPRESENTATNE OF ACTUAL PROJECT QUANTITIES. REFER TO FLOOR PLANS AND ENLARGED
FLOOR PLANS FOR ACTUAL QUANTITIES AN� LOCATIONS OF DEVICES AN� MORE SPEQFlC
ROUTING MFORMATION. REFER TO SPECIFICATIONS FOR AD�ITIONAL REpUIREMENTS.
2. ALL CONDUCTORS IN THE TECHNOLOGV BONDMG SYSTEM SHALL BE MINIMUM SIZE OF 3/O AWG
PLENUM RATED COPPER (GREEN OR MARKED W ITH A DISTWCTNE GREEN COLOR) UNLESS
CONDUCTOR LENGTH IS LESS THAN 66 FEET. REFER TO BONDING CON�UCTOR SIZING SCHEDULE
FOR SIZMG CRITEFIA FOR CONDUCTORS LESS THAN 66 FEET IN LENGTH. REFER TO
SPEQFICATIONS FOR A�DITIONAL REQUIREMENTS.
3. ALLBONDINGCONDUCTORSANDBON�INGJUMPERSSHALLBECONNECTEDBVCOMPRESSION
LUGS E%OTHERMIC WELDING, OR IRREVERSIBLE COMPRESSION CONNECTORS. SOLDER IS NOTAN
ACCEPTABLE MEANS OF CONNECTION. SHEET METAL SCREWS SHALL NOT BE USED TO CONNECT
COMMUNICATIONS BONDING CONDUCTORS TO EQUIPMENT. WHERE NECESSARK REMOVE PAINT
ANDIOR USE PAINT-PIERCING WASHERS TO PROVIDE PROPER ELECTRICAL BOND ATALL
CONNECTIONS.
4. REFER TO 3/T]-00 FOR TVPICAL TELECOM ROOM BONDING FLOW DIAGRAM.
5. REFERTOTELECOM ROOM REFERENCESSCHEDULEONTECHNOLOGVCOVERSHEETFOR
' --�MMUNICATIONS ROOM NUMBERAND LOCATION INFORMATION.
RELEA5E0 FOR CONSTRUCTION
Suhjec��ocompliancewithallregula�ions IGCONDUCTORFORTELECOMMUNICATIONS(BCT).BCTSHALLBETHESAMESREASTHE
o4S�a�eantlLocalCodes �RGER.REFERTOBONDINGCONDUCTORSIZINGSCHEDULEFORSIZINGREQUIREMENTS.
City of Carmel
�
y�n„� ��.�a,�,a'
�
onrE: 06/11 /20
TELECOMMUNICATIONS
BON�ING JUMPER (TBJ)
�
O � I SC-GND-0
TELECOMMUNICATIONS
BONDING JUMPER (TBJ)
BUILDING
sTEE�
TELECOMMUNICATIONSROOM,TR-k, 10
CONDUITS �)
AND SLEEVES
CABLETRAY
(CONTINUOUS
BOND
EQUIPMENT O
RACK(S)
ACCESS
CONTROL
TELECOM ROOM BONDING FLOW DIAGRAM
BONDING CONDUCTOR SIZING SCHEDULE
CONDUCTOR MINIMUM ACCEPTABLE
LENGTH IN FEET SIZE - AWG
LESS THAN 13' 6
14' - 20' 4
21' - 26' 3
2T-33' 2
34'-41' 1
4T-ST 1/0
53'-66' 2/0
GREATER THAN 66' 3/0
NOTES:
1. THIS FLOW DIAGRAM IS �IAGRAMMATIC AND MAV NOT SHOW ACTUAL ROUTING OR QUANTITIES OF MATERIALS. THIS FLOW
DIAGRAM IS SHOW N FOR CLARIFICATION OF CONNECTION LOCATIONS AND CONDUCTOR TVPE. ALL CONNECTIONS AND SVSTEM
DEVICES SHOWN ARE TVPICAL AND NOT REPRESENTATNE OF ACTUAL PROJECT QUANTITIES. REFER TO ROOR PLANS AND
ENLARGED FLOOR PLANS FOR ACTUAL QUANTITIES AND LOCATIONS OF DEVICES ANO MORE SPECIFIC ROUTING INFORMATION.
REFER TO SPECIFlCATIONS FOR AooIT10NAL RE�UIREMENTS.
2. ALL CONDUCTORS IN THE TECHNOLOGV BONDING SVSTEM SHALL BE MINIMUM SIZE OF 3IOAWG PLENUM RATED COPPER (GREEN
OR MARKED W ITH A DISTWCTIVE GREEN COLOR) UNLESS CONOUCTOR LENGTH IS LE55 THAN 66 FEET. REFER TO BONDING
CONDUCTOR SIZING SCHEDl1LE FOR SIZING CRITERIA FOR CONDUCTORS LESS THAN 66 FEET M LENGTH. REFER TO
SPEqFlCATIONS FOR ADDITIONAL RE�UIREMENTS.
3. ALLBON�INGCON�l1CTORSANDBONDINGJUMPERSSHALLBECONNECTEDBVCOMPRES510NWG5,EXOTHERMICWELDING,OR
IRREVERSIeLE COMPRESSION CONNECTORS. SOLDER IS NOT AN ACCEPTAeLE MEANS OF CONNECTION. SHEET METAL SCREWS
SHALL NOT BE USED TO CONNECT COMMUNICATIONS BONDING CON�UCTORS TO EOUIPMENT. WHERE NECESSARV, REMOVE
PAMT AND/OR USE PAINT-PIERCING WASHERS TO PROVIDE PROPER ELECTRICAL BOND AT ALL CONNECTIONS.
4. REFER TO 4/T7-00 FOR BONDING BUS BAR DETAIL AND ADDITIONAL INFORMATION AND REQUIREMENTS FOR SGGND4.
KEVNOTES:
1. REFER TO TELECOM ROOM REFERENCES SCHEDULE ON TECHNOLOGV COVERSHEET FOR TELECOMMUNICATIONS ROOM NUMBER
AN� LOCATION MFORMATION.
2 INCLU�ES HORIZONTAL AND VERTICAL CONDUIT SLEEVES FOR TECHNOLOGV CABLING.
3. TELECOMMUNICATIONS BONDWG BACKBONE (TBB). REFER T02IT7-00 FOR TECHNOLOGV BONDING RISER DIAGRAM.
4. BONDINGCONDUCTORFORTELECOMMUNICATIONS(BCT�,TOELECTRICALENTRANCEINTERSVSTEMBONDINGTERMINATION.
REFER TO 2/r]-00 FOR TECHNOLOGV BONDING RISER DIAGRAM FOR CONTINUATION AND A�OITIONAL INFORMATION AND
REQUIREMENTS.
5. REFERTOTHEELECTRICALDRAWINGSFORLOCATION.
6. PROVIOESC-GN0.2RACKMOUNTTELECOMMl1NICATIONSBONDINGBUSBARATEACHEQUIPMENTRACK.
SECOND
FLOOR
PARKING
GARAGE
FIRST
FLOOR
PARKING
GARAGE
COPPER BONDING CONDUCTOR TO
EQUIPMENT RACKS, CABLE TRAVS &
METALLIC SLEEVES. REFER TO
SPECIFICATIONS FOR DETAILS
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TWO HOLE COMPRESSION LUG�
/f
J 1 J 1 �
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i� J ,
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I
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� - .- 4
MOLDEOPOLVESTER-
FIBERGLASS INSULATOR
�
0
� � 5/18"H
(TVP)
BARE COPPER GROUND BAR,
INSULATORS,BRACKETSAN�
BONDING PROVIDED BV E.C.
REFERTOTECHNOLOGV
EOUIPMENT SCHEDULE SC-GND-0
COPPERGROUNDCONDUCTOR
FROM BUILDWG SERVICE GROUND.
REFER TO SPECIFlCATIONS FOR
DETAILS
i1 BONDING BUS BAR DETAIL
� NO SCALE
NOTES:
1. REFERTOTECHNOLOGVE�UIPMENTSCHEDULESGGND4FOR
W IDTH REQUIREMENTS.
2. REFERT03/r�-OOPoRTYPICALTELECOMROOMBONDINGROW
DIAGRAM.
ArchitecNre I Engineering I Interior Design
1115 Magnavox Way I 930 Nohh Mentlian
Fort Wayne, IN 46804 Intlianapolis, IN 46204
260.432.9337 31].917.1190
wwwmskitlmm
<:IMEG
8900 KEVSTONE XING SUITE 210
INDIANAPOLIS, IN 46240
31�.848.5045 FAX:31�.8442201
www.imegcorp.com
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PROJECT NO. DATE
18004130.00 12-12-19
REV.
SET DESCRIPTION
BP #4.1 - Arch/MEPT/
Garage Documents
DATE
SHEET TITLE
TECHNOLOGY RISER
DIAGRAMS
SHEETNUMBER
T7-00
�.,. ....`� 12/12/19
MSKTD
& Associates